Teck Kheng Lee: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability

Lee, Teck Kheng, Breach, C. D, Chong, Wei Ling

Year:

2011

Language:

english

File:

PDF, 1.15 MB

english, 2011

2

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Investigation of palladium coverage on bonded balls of palladium-coated copper wires

Koh, Wei, Lee, Teck-Kheng, Ng, Hun-Shen, Goh, Kay-Soon, Ho, Hong-Meng

Year:

2011

Language:

english

File:

PDF, 1.05 MB

english, 2011

3

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion

Breach, C. D., Hun Shen, Ng, Lee, Teck Kheng, Holliday, R.

Year:

2011

Language:

english

File:

PDF, 1.56 MB

english, 2011

4

Material and design considerations of FBGA reliability performance

Teck Kheng Lee, Teng Chye Ng, Yih Ming Chai

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 1.27 MB

english, 2004

5

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Interfacial Adhesion Studies using Double Cantilever Beam Method and Shear Testing

Lee, Teck Kheng

Year:

2007

Language:

english

File:

PDF, 753 KB

english, 2007

6

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Fine Pitch Au-SnAgCu Joint-in-via Flip-Chip Packaging

Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C.

Year:

2007

Language:

english

File:

PDF, 518 KB

english, 2007

7

A model of optimising the needle insertion through deflection studies

Foo, Soo Leong, Ng, Ka Wei, Goh, Jin Quan, Ting, Poh Hua, Lee, Teck Kheng, Esuvaranathan, Kesavan, Wu, Qing Hui, Chiong, Edmund

Journal:

International Journal of Biomedical Engineering and Technology

Year:

2014

Language:

english

File:

PDF, 892 KB

english, 2014

8

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Insulated PdCu wire bond challenges and resolution for HVM robustness

Teck, Siong Chin, Leng, Eu Poh, Chu, Tan Lan, Ibrahim, Mohd Rusli, Kheng, Au Ying, Yun, Yow Kai, Xi, Zhang, Lee, Cheryl, Dan, Su, Wei, Tok Chee, Murali, Sarangapani

Year:

2014

Language:

english

File:

PDF, 2.88 MB

english, 2014

9

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Development of low-cost wafer level package through integrated design and simulation analysis

Tee, Tong Yan, Siew, Glen, Chen, Haoyang, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 4.55 MB

english, 2011

10

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Effects of moisture on reliability of gold and copper ball bonds

Breach, C. D., Hun Shen, Ng, Tee Wai Mun,, Lee, Teck Kheng, Holliday, R.

Year:

2010

Language:

english

File:

PDF, 2.17 MB

english, 2010

11

Instantaneous fluxless bonding of Au with Pb–Sn solder in ambient atmosphere

Lee, Teck Kheng, Zhang, Sam, Wong, Chee Cheong, Tan, Ah Chin

Journal:

Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 1.00 MB

english, 2005

12

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Prototyping of low-cost wafer level packages

Chen, Haoyang, Tee, Tong Yan, Siew, Glen, Soh, Serine, Kang, In Soo, Kim, Jong Heon, Lee, Teck Kheng, Ser, Bok Leng, Ng, Hun Shen, Hoe, Germaine, Gao, Shan

Year:

2011

Language:

english

File:

PDF, 1.72 MB

english, 2011

13

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - A Novel Approach of Depositing Embedded Resistors

Tan Kwang Hong,, Lee Teck Kheng,

Year:

2005

File:

PDF, 3.07 MB

2005

14

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Comparison of SLICF with C4 for flip chip bonding with Au, Cu, Pd and Ag studs with SAC solder

Kheng, Lee Teck, Leng, Ser Bok, Ling, Chong Wee, Tun, Khin Sandar, Qiang, Yan Guo

Year:

2013

Language:

english

File:

PDF, 1.68 MB

english, 2013

15

Effect of Cooling Rate on the Microstructures and Mechanical Properties of Mg-Y Alloys

Sim, Goh Chwee, Tun, Khin Sandar, Tan, Xing He, Weng, Chan Kwok Jimmy, Onn, Kwok Wai Richard, Gupta, Manoj, Lee, Teck Kheng

Journal:

Applied Mechanics and Materials

Year:

2014

Language:

english

File:

PDF, 2.10 MB

english, 2014

16

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Resist defined bump with fluxless flip chip bonding for productivity and reliability

Kheng, Lee Teck, Leng, Ser Bok, Qiang, Yan Guo, Beng Chuan, Tioh

Year:

2016

File:

PDF, 789 KB

2016

17

Dissolution and reaction between Au and molten eutectic PbSn solder

Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan

Journal:

Materials Science and Engineering: A

Year:

2006

Language:

english

File:

PDF, 484 KB

english, 2006

18

Fluxless flip chip bonding with joint-in-via architecture

Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 600 KB

english, 2006

19

[IEEE 2018 IEEE 8th International Nanoelectronics Conferences (INEC) - Kuala Lumpur, Malaysia (2018.1.3-2018.1.5)] 2018 IEEE 8th International Nanoelectronics Conferences (INEC) - Fluxless Flip Chip Interconnects for MEMS Devices for Heterogeneous Integration

Lee, Teck Kheng

Year:

2018

Language:

english

File:

PDF, 870 KB

english, 2018

20

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging

Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C.

Year:

2007

Language:

english

File:

PDF, 2.94 MB

english, 2007

21

ECS Transactions [ECS China Semiconductor Technology International Conference 2011 (CSTIC 2011) - Shanghai, China (March 13 - March 14, 2011)] - Corrosion of Gold and Copper Ball Bonds

Breach, Christopher D., Ng, Hun Shen, Lee, Teck Kheng, Holliday, Richard

Year:

2011

Language:

english

File:

PDF, 987 KB

english, 2011

22

[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Challenges and resolution of insulated PdCu wire bond for TBGA HVM robustness

Teck, Siong Chin, Leng, Eu Poh, Chu, Tan Lan, Ibrahim, Mohd Rusli, Kheng, Au Ying, Xi, Zhang, Lee, Cheryl, Dan, Su, Wei, Tok Chee, Murali, Sarangapani, Lyn, Robert

Year:

2014

Language:

english

File:

PDF, 2.00 MB

english, 2014

23

[IEEE International Symposium on Electronic Materials and Packaging (EMAP2000) - Hong Kong, China (30 Nov.-2 Dec. 2000)] International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) - Enhancement of moisture sensitivity performance of a FBGA

Lee Teck Kheng,, Lee Kian Chai,, Chai Yih Ming,, Ng Yew Hong,

Year:

2000

Language:

english

File:

PDF, 1.56 MB

english, 2000

24

[IEEE 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2017.10.25-2017.10.27)] 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Trace-in-bump for flip chip applications

Lee, Teck Kheng, Ser, Bok Leng, Kumar, Amit

Year:

2017

Language:

english

File:

PDF, 1.22 MB

english, 2017

25

Processing of High Strength Magnesium Alloy with Enhanced Plasticity Using Squeeze Casting

Tun, Khin Sandar, Sim, Goh Chwee, Tan, Xing He, Chan, Kwok Weng Jimmy, Kwok, Wai Onn Richard, Lee, Teck Kheng, Gupta, Manoj

Journal:

Advanced Materials Research

Year:

2015

Language:

english

File:

PDF, 600 KB

english, 2015

26

ValuedCare program: a population health model for the delivery of evidence-based care across care continuum for hip fracture patients in Eastern Singapore

Mittal, Chikul, Lee, Hsien Chieh Daniel, Goh, Kiat Sern, Lau, Cheng Kiang Adrian, Tay, Leeanna, Siau, Chuin, Loh, Yik Hin, Goh, Teck Kheng Edward, Sandi, Chit Lwin, Lee, Chien Earn

Journal:

Journal of Orthopaedic Surgery and Research

Year:

2018

Language:

english

File:

PDF, 1.22 MB

english, 2018

27

Multimodal assessments of Zika virus immune pathophysiological responses in marmosets

Lum, Fok-Moon, Zhang, Wei, Lim, Kheng-Choon, Malleret, Benoit, Teo, Teck-Hui, Koh, Jun-Jia, Lee, Kuan J., Chua, Tze-Kwang, Kam, Yiu-Wing, Yee, Wearn-Xin, Huen, Isaac, Tan, Jeslin J. L., Amrun, Siti Na

Journal:

Scientific Reports

Year:

2018

Language:

english

File:

PDF, 5.82 MB

english, 2018

28

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Oxidation and corrosion of Au/Al and Cu/Al in wire bonding assembly

Lee, Teck Kheng, Breach, C.D, Chong, Wee Ling, Goh, Chwee Sim

Year:

2012

Language:

english

File:

PDF, 1.85 MB

english, 2012

29

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Moisture induced corrosion in gold and copper ball bonds

Breach, C. D., Wai Mun, Tee, Lee, Teck Kheng, Holliday, R.

Year:

2010

Language:

english

File:

PDF, 1.19 MB

english, 2010

30

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - The effect of ball pad designs and substrate materials on the performance of second-level interconnects

Lim, A.C.P., Lee Teck Kheng,, Alamsjah, A., Happy,

Year:

2003

Language:

english

File:

PDF, 404 KB

english, 2003

31

[IEEE Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Effects of ball pad configuration on joint reliability in BGA chip-scale packages

Chong, V., Lee Teck Kheng,, Dewi Kartika Gunawan,, Lim Chwee Teck,

Year:

2004

Language:

english

File:

PDF, 350 KB

english, 2004

32

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - A Novel Approach of Depositing Embedded Resistors

Tan Kwang Hong,, Lee Teck Kheng,

Year:

2005

Language:

english

File:

PDF, 3.07 MB

english, 2005

33

Effects of Sterilization Cycles on PEEK for Medical Device Application

Kumar, Amit, Yap, Wai Teng, Foo, Soo Leong, Lee, Teck Kheng

Journal:

Year:

2018

Language:

english

File:

PDF, 2.30 MB

english, 2018

34

Empirical equations for moisture absorption of a rigid substrate

Teck Kheng Lee, Kian Chai Lee, Sian Yong Khoo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 632 KB

english, 2004

35

Interfacial microstructures and kinetics of Au/SnAgCu

Teck Kheng Lee, Sam Zhang, C.C. Wong, A.C. Tan, Davin Hadikusuma

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 277 KB

english, 2006

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски